Cosimulation of Power and Temperature Models at the SystemC/TLM for a Soft-Core Processor
Nowadays, modern embedded applications are becoming more and more complex and resource demanding. Fortunately, Systems on Chip (SoC) are one of the keys used to follow their requirements that stand in need of high performance while maintaining a low-power profile. On one hand, today, due to the limi...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Hindawi Limited
2020-01-01
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| Series: | Advances in Materials Science and Engineering |
| Online Access: | http://dx.doi.org/10.1155/2020/2567915 |