Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

In this study, the combined effect of GNSs (graphene nanosheets) and ENIAg (Electroless Nickel Immersion Silver) surface finish on the formation of intermetallic compounds (IMCs) and shear strength of the Sn-1.0Ag-0.5Cu (SAC105) solder system was studied. Both plain and composite solder systems (SAC...

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Bibliographic Details
Main Authors: K. Vidyatharran, M.A. Azmah Hanim, T.T. Dele-Afolabi, K.A. Matori, O. Saliza Azlina
Format: Article
Language:English
Published: Elsevier 2021-11-01
Series:Journal of Materials Research and Technology
Subjects:
Lead-free solders
Graphene nanosheets
ENIAg surface finish
Intermetallic compounds
Shear strength
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785421010486

Internet

http://www.sciencedirect.com/science/article/pii/S2238785421010486

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