Improved sinter-bonding properties of silver-coated copper flake paste in air by the addition of sub-micrometer silver-coated copper particles
To promptly form a bondline with high thermal stability and thermal conductivity using a small amount of expensive Ag, dies were attached to Ag finishes by pressure-assisted sinter bonding at 300 °C using micrometer-sized Ag-coated Cu (Cu@Ag) flakes. Small Cu@Ag particles of 350 nm size were also ad...
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2020-11-01
|
| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785420320354 |