Enhanced Virtual Metrology on Chemical Mechanical Planarization Process using an Integrated Model and Data-Driven Approach

As an essential process in semiconductor manufacturing, Chemical Mechanical Planarization has been studied in recent decades and the material removal rate has been proved to be a critical performance indicator. Comparing with after-process metrology, virtual metrology shows advantages in production...

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Bibliographic Details
Main Authors: Yuan Di, Xiaodong Jia, Jay Lee
Format: Article
Language:English
Published: The Prognostics and Health Management Society 2017-06-01
Series:International Journal of Prognostics and Health Management
Subjects:
Online Access:https://papers.phmsociety.org/index.php/ijphm/article/view/2641