Mechanism and Motion of Semifixed Abrasive Grit for Wire-Saw Slicing
The currently dominant method in the production of wafers is to use slurry wire-saw slicing. This paper reports a new wire-saw slicing technology, namely, semifixed abrasive wire-saw slicing. The traditional smooth wire is replaced by a patterned wire with a textured surface that can help the wire c...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
SAGE Publishing
2013-01-01
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| Series: | Advances in Mechanical Engineering |
| Online Access: | https://doi.org/10.1155/2013/628027 |