Investigating the Joining of Ni3Al Intermetallic Compound, using Transient Liquid Phase (TLP) Method with Cu Interlayer
In this study, joining of Ni3Al intermetallic compounds using the transient liquid phase (TLP) process with Cu interlayer was investigated. The binding process was carried out in a vacuum furnace at a temperature of 1050 °C for different times of 30, 60, 90 and 120 minutes. The effect of time variat...
| Main Authors: | , , |
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| Format: | Article |
| Language: | fas |
| Published: |
Isfahan University of Technology
2020-01-01
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| Series: | Journal of Advanced Materials in Engineering |
| Subjects: | |
| Online Access: | http://jame.iut.ac.ir/article-1-1047-en.html |