The Effect of Thin Film Deposition Angle and Substrate Surface Roughness on Film Dissolution in Molten 60% Sn–40% Pb Solder
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| Format: | Article |
| Language: | English |
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Hindawi Limited
1977-01-01
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| Series: | Active and Passive Electronic Components |
| Online Access: | http://dx.doi.org/10.1155/APEC.4.43 |