Application of a Force Sensor in Wire Bonding Process
Wire bonder is important equipment in semiconductor end-package. The benefits of using force sensor are precisely force control and earlier contact detection. In this paper, we introduced an application of a force sensor in the wire bonding process. We proposed the control strategy of the whole bond...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IFSA Publishing, S.L.
2013-11-01
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| Series: | Sensors & Transducers |
| Subjects: | |
| Online Access: | http://www.sensorsportal.com/HTML/DIGEST/november_2013/PDF_vol_159/P_RP_0013.pdf |