Mini-Review: Modeling and Performance Analysis of Nanocarbon Interconnects
As the interconnect delay exceeds the gate delay, the integrated circuit (IC) technology has evolved from a transistor-centric era to an interconnect-centric era. Conventional metallic interconnects face several serious challenges in aspects of performance and reliability. To address these issues, n...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2019-05-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/9/11/2174 |