Mini-Review: Modeling and Performance Analysis of Nanocarbon Interconnects

As the interconnect delay exceeds the gate delay, the integrated circuit (IC) technology has evolved from a transistor-centric era to an interconnect-centric era. Conventional metallic interconnects face several serious challenges in aspects of performance and reliability. To address these issues, n...

Full description

Bibliographic Details
Main Authors:	Wen-Sheng Zhao, Kai Fu, Da-Wei Wang, Meng Li, Gaofeng Wang, Wen-Yan Yin
Format:	Article
Language:	English
Published:	MDPI AG 2019-05-01
Series:	Applied Sciences
Subjects:	carbon nanotube (CNT) graphene nanoribbon (GNR) circuit modeling interconnects nanocarbon electrothermal co-simulation
Online Access:	https://www.mdpi.com/2076-3417/9/11/2174

id	doaj-dbbd51b34e9449e0949ec0975cd3b365
record_format	Article
spelling	doaj-dbbd51b34e9449e0949ec0975cd3b3652020-11-25T01:34:41ZengMDPI AGApplied Sciences2076-34172019-05-01911217410.3390/app9112174app9112174Mini-Review: Modeling and Performance Analysis of Nanocarbon InterconnectsWen-Sheng Zhao0Kai Fu1Da-Wei Wang2Meng Li3Gaofeng Wang4Wen-Yan Yin5Key Lab of RF Circuits and Systems of Ministry of Education, School of Electronics and Information, Hangzhou Dianzi University, Hangzhou 310018, ChinaKey Lab of RF Circuits and Systems of Ministry of Education, School of Electronics and Information, Hangzhou Dianzi University, Hangzhou 310018, ChinaKey Lab of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province, College of Information Science and Electronic Engineering, Innovative Institute of Electromagnetic Information and Electronic Integration, Zhejiang University, Hangzhou 310058, ChinaBeijing Aerospace Technology Institute, Beijing 100074, ChinaKey Lab of RF Circuits and Systems of Ministry of Education, School of Electronics and Information, Hangzhou Dianzi University, Hangzhou 310018, ChinaKey Lab of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province, College of Information Science and Electronic Engineering, Innovative Institute of Electromagnetic Information and Electronic Integration, Zhejiang University, Hangzhou 310058, ChinaAs the interconnect delay exceeds the gate delay, the integrated circuit (IC) technology has evolved from a transistor-centric era to an interconnect-centric era. Conventional metallic interconnects face several serious challenges in aspects of performance and reliability. To address these issues, nanocarbon materials, including carbon nanotube (CNT) and graphene, have been proposed as promising candidates for interconnect applications. Considering the rapid development of nanocarbon interconnects, this paper is dedicated to providing a mini-review on our previous work and on related research in this field.https://www.mdpi.com/2076-3417/9/11/2174carbon nanotube (CNT)graphene nanoribbon (GNR)circuit modelinginterconnectsnanocarbonelectrothermal co-simulation
collection	DOAJ
language	English
format	Article
sources	DOAJ
author	Wen-Sheng Zhao Kai Fu Da-Wei Wang Meng Li Gaofeng Wang Wen-Yan Yin
spellingShingle	Wen-Sheng Zhao Kai Fu Da-Wei Wang Meng Li Gaofeng Wang Wen-Yan Yin Mini-Review: Modeling and Performance Analysis of Nanocarbon Interconnects Applied Sciences carbon nanotube (CNT) graphene nanoribbon (GNR) circuit modeling interconnects nanocarbon electrothermal co-simulation
author_facet	Wen-Sheng Zhao Kai Fu Da-Wei Wang Meng Li Gaofeng Wang Wen-Yan Yin
author_sort	Wen-Sheng Zhao
title	Mini-Review: Modeling and Performance Analysis of Nanocarbon Interconnects
title_short	Mini-Review: Modeling and Performance Analysis of Nanocarbon Interconnects
title_full	Mini-Review: Modeling and Performance Analysis of Nanocarbon Interconnects
title_fullStr	Mini-Review: Modeling and Performance Analysis of Nanocarbon Interconnects
title_full_unstemmed	Mini-Review: Modeling and Performance Analysis of Nanocarbon Interconnects
title_sort	mini-review: modeling and performance analysis of nanocarbon interconnects
publisher	MDPI AG
series	Applied Sciences
issn	2076-3417
publishDate	2019-05-01
description	As the interconnect delay exceeds the gate delay, the integrated circuit (IC) technology has evolved from a transistor-centric era to an interconnect-centric era. Conventional metallic interconnects face several serious challenges in aspects of performance and reliability. To address these issues, nanocarbon materials, including carbon nanotube (CNT) and graphene, have been proposed as promising candidates for interconnect applications. Considering the rapid development of nanocarbon interconnects, this paper is dedicated to providing a mini-review on our previous work and on related research in this field.
topic	carbon nanotube (CNT) graphene nanoribbon (GNR) circuit modeling interconnects nanocarbon electrothermal co-simulation
url	https://www.mdpi.com/2076-3417/9/11/2174
work_keys_str_mv	AT wenshengzhao minireviewmodelingandperformanceanalysisofnanocarboninterconnects AT kaifu minireviewmodelingandperformanceanalysisofnanocarboninterconnects AT daweiwang minireviewmodelingandperformanceanalysisofnanocarboninterconnects AT mengli minireviewmodelingandperformanceanalysisofnanocarboninterconnects AT gaofengwang minireviewmodelingandperformanceanalysisofnanocarboninterconnects AT wenyanyin minireviewmodelingandperformanceanalysisofnanocarboninterconnects
_version_	1725070248129855488

Mini-Review: Modeling and Performance Analysis of Nanocarbon Interconnects

Similar Items