Epoxy-Based Composite Adhesive Containing Silver Coated Copper Powder: Preparation and Evaluation of Its Electrical Properties
The progress in scientific and technical products and increasing needs for advanced electrical and electronic devices have motivated researchers to investigate new ideas in this field. One of the main challenges in this way is the connection between microchips and other parts of electrical boards. L...
| Main Authors: | , , |
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| Format: | Article |
| Language: | fas |
| Published: |
Iran Polymer and Petrochemical Institute
2017-03-01
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| Series: | علوم و تکنولوژی پلیمر |
| Subjects: | |
| Online Access: | http://jips.ippi.ac.ir/article_1461_4807b6f9afbfa3d92e53e0818f8bbffc.pdf |