Effects of heat sink compounds on contact resistance of porous media

High and low-conductivity heat sink compounds were applied in succession on a thermal probe, which was then used to determine the thermal conductivity and thermal diffusivity of some porous media at room temperature. The experiment was conducted separately under different packing densities and water...

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Bibliographic Details
Main Authors: Akinyemi Olukayode D., Sauer Thomas J.
Format: Article
Language:English
Published: VINCA Institute of Nuclear Sciences 2007-01-01
Series:Thermal Science
Subjects:
Online Access:http://www.doiserbia.nb.rs/img/doi/0354-9836/2007/0354-98360704113A.pdf