Resistance Change Mechanism of Electronic Component Mounting through Contact Pressure Using Elastic Adhesive
For mounting electronic components through contact pressure using elastic adhesives, a high contact resistance is an inevitable issue in achieving solderless wiring in a low-temperature and low-cost process. To decrease the contact resistance, we investigated the resistance change mechanism by measu...
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2019-06-01
|
| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/10/6/396 |