Regularities of microdefect formation in silicon during heat treatment for internal getter synthesis

Gettering is defined as a process by which metal impurities in the device region are reduced by localizing them in predetermined, passive regions of the silicon wafer. Internal or intrinsic gettering is an effective way to reduce the contamination in active regions. The generation of...

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Main Authors: Vladimir T. Bublik, Marina I. Voronova, Kirill D. Shcherbachev, Mikhail V. Mezhennyi, Vladimir Ya. Reznik
Format: Article
Language:English
Published: Pensoft Publishers 2019-09-01
Series:Modern Electronic Materials
Online Access:https://moem.pensoft.net/article/52812/download/pdf/
id doaj-de20dddca935401ca7dfee10f5984024
record_format Article
spelling doaj-de20dddca935401ca7dfee10f59840242021-04-02T12:03:38ZengPensoft PublishersModern Electronic Materials2452-17792019-09-015313313910.3897/j.moem.5.5281252812Regularities of microdefect formation in silicon during heat treatment for internal getter synthesisVladimir T. Bublik0Marina I. Voronova1Kirill D. Shcherbachev2Mikhail V. Mezhennyi3Vladimir Ya. Reznik4National University of Science and Technology MISiSNational University of Science and Technology MISiSNational University of Science and Technology MISiSJSC OptronJSC Optron Gettering is defined as a process by which metal impurities in the device region are reduced by localizing them in predetermined, passive regions of the silicon wafer. Internal or intrinsic gettering is an effective way to reduce the contamination in active regions. The generation of internal getters is based on the decomposition of the supersaturated oxygen solid solution in silicon, which favours the formation of a complex defect system in silicon that consists of various precipitate/dislocation agglomerates. Regularities of microdefect formation during oxygen solid solution decomposition in silicon have been studied. We show that actual solid solution supersaturation, temperature and heat treatment duration determine the structure of the solid solution. Combining these factors, including heat treatment parameters, one can control solid solution decomposition rate and SiOx precipitate sizes and quantity. The methods of X-ray diffuse scattering and transmission electron microscopy have shown high efficiency for studying the effect of heat treatment in crystals. For annealing at 450 °C, solid solution decomposition occurs at high supersaturation degrees, and concentration inhomogeneity regions may form at an early decomposition stage over the actual annealing time (up to 40 h). With an increase in the temperature of subsequent annealing to 650 °C, local regions with above-average oxygen supersaturation degrees increase the efficiency of oxygen solid solution decomposition. Further, an increase in annealing temperature to T > 1000 °С results in a more intense generation of the largest precipitates at the expense of the smaller ones. Once the precipitate sizes become sufficiently large, the elastic stresses start to relax, leading to partial incoherence and the generation of dislocations around the particles. This type of defect structure seems to be the most efficient getter. https://moem.pensoft.net/article/52812/download/pdf/
collection DOAJ
language English
format Article
sources DOAJ
author Vladimir T. Bublik
Marina I. Voronova
Kirill D. Shcherbachev
Mikhail V. Mezhennyi
Vladimir Ya. Reznik
spellingShingle Vladimir T. Bublik
Marina I. Voronova
Kirill D. Shcherbachev
Mikhail V. Mezhennyi
Vladimir Ya. Reznik
Regularities of microdefect formation in silicon during heat treatment for internal getter synthesis
Modern Electronic Materials
author_facet Vladimir T. Bublik
Marina I. Voronova
Kirill D. Shcherbachev
Mikhail V. Mezhennyi
Vladimir Ya. Reznik
author_sort Vladimir T. Bublik
title Regularities of microdefect formation in silicon during heat treatment for internal getter synthesis
title_short Regularities of microdefect formation in silicon during heat treatment for internal getter synthesis
title_full Regularities of microdefect formation in silicon during heat treatment for internal getter synthesis
title_fullStr Regularities of microdefect formation in silicon during heat treatment for internal getter synthesis
title_full_unstemmed Regularities of microdefect formation in silicon during heat treatment for internal getter synthesis
title_sort regularities of microdefect formation in silicon during heat treatment for internal getter synthesis
publisher Pensoft Publishers
series Modern Electronic Materials
issn 2452-1779
publishDate 2019-09-01
description Gettering is defined as a process by which metal impurities in the device region are reduced by localizing them in predetermined, passive regions of the silicon wafer. Internal or intrinsic gettering is an effective way to reduce the contamination in active regions. The generation of internal getters is based on the decomposition of the supersaturated oxygen solid solution in silicon, which favours the formation of a complex defect system in silicon that consists of various precipitate/dislocation agglomerates. Regularities of microdefect formation during oxygen solid solution decomposition in silicon have been studied. We show that actual solid solution supersaturation, temperature and heat treatment duration determine the structure of the solid solution. Combining these factors, including heat treatment parameters, one can control solid solution decomposition rate and SiOx precipitate sizes and quantity. The methods of X-ray diffuse scattering and transmission electron microscopy have shown high efficiency for studying the effect of heat treatment in crystals. For annealing at 450 °C, solid solution decomposition occurs at high supersaturation degrees, and concentration inhomogeneity regions may form at an early decomposition stage over the actual annealing time (up to 40 h). With an increase in the temperature of subsequent annealing to 650 °C, local regions with above-average oxygen supersaturation degrees increase the efficiency of oxygen solid solution decomposition. Further, an increase in annealing temperature to T > 1000 °С results in a more intense generation of the largest precipitates at the expense of the smaller ones. Once the precipitate sizes become sufficiently large, the elastic stresses start to relax, leading to partial incoherence and the generation of dislocations around the particles. This type of defect structure seems to be the most efficient getter.
url https://moem.pensoft.net/article/52812/download/pdf/
work_keys_str_mv AT vladimirtbublik regularitiesofmicrodefectformationinsiliconduringheattreatmentforinternalgettersynthesis
AT marinaivoronova regularitiesofmicrodefectformationinsiliconduringheattreatmentforinternalgettersynthesis
AT kirilldshcherbachev regularitiesofmicrodefectformationinsiliconduringheattreatmentforinternalgettersynthesis
AT mikhailvmezhennyi regularitiesofmicrodefectformationinsiliconduringheattreatmentforinternalgettersynthesis
AT vladimiryareznik regularitiesofmicrodefectformationinsiliconduringheattreatmentforinternalgettersynthesis
_version_ 1721570331367309312