Development of Crack Detection Method with 2 Dimensionally Generated 3 Dimensionally Reconstructed Images in THT Solder Joints
This work represents an interesting development in the detection and interpretation of crack evolution in through hole technology (THT) solder joints, which based on the development of general and common method. Serial sectioning is a useful method because it overcomes the problems associated with t...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Polish Academy of Sciences
2017-06-01
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| Series: | Archives of Metallurgy and Materials |
| Subjects: | |
| Online Access: | http://www.degruyter.com/view/j/amm.2017.62.issue-2/amm-2017-0148/amm-2017-0148.xml?format=INT |