A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders
Low-temperature lead (Pb)-free solders are demanding in the electronic packaging industry, because it would open the door for various economic choices of polymeric materials as substrates and also revives the lower cost processes. Here, we proposed a tin⁻bismuth⁻indium⁻...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2019-02-01
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| Series: | Materials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1944/12/4/631 |