Thermal Sensitive Shape Memory Behavior of Epoxy Composites Reinforced with Silicon Carbide Whiskers
A novel shape memory polymer composite was fabricated by introducing various amounts of silicon carbide whiskers (SiCws) into a shape memory epoxy. The relationship between the thermomechanical properties of the system and structural changes were investigated via dynamic mechanical analysis, scannin...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2017-01-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | http://www.mdpi.com/2076-3417/7/1/108 |