Analysis of Printed Circuit Boards strains using finite element analysis and digital image correlation
This paper investigates the use of digital image correlation (DIC) and finite element analysis for strain measurement on Printed Board Circuits (PCBs). Circuit boards (PCBs) are designed to mechanically support and electrically connect an electronic component assembly. Due to screw assemblies, th...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Gruppo Italiano Frattura
2020-01-01
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| Series: | Frattura ed Integrità Strutturale |
| Subjects: | |
| Online Access: | https://www.fracturae.com/index.php/fis/article/view/2663 |