Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites—A Review
Epoxy resin composites filled with thermally conductive but electrically insulating particles play an important role in the thermal management of modern electronic devices. Although many types of particles are used for this purpose, including oxides, carbides and nitrides, one of the most widely use...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-08-01
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| Series: | Materials |
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| Online Access: | https://www.mdpi.com/1996-1944/13/16/3634 |