Interfacial reaction, microstructure and mechanical properties of Sn58Bi solder joints on graphene-coated Cu substrate
The wettability, interfacial reaction, microstructure and hardness of Sn58Bi (SnBi) solder paste on Cu, high-temperature Cu (H-Cu) and graphene-coated Cu (G-Cu) were investigated in this study. Experimental results indicate that the wettability of Sn58Bi solder on G-Cu is higher than that on Cu and...
| Main Authors: | , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2019-06-01
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| Series: | Results in Physics |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2211379719302001 |