Comparing the Through-Thickness Gradient of the Deformed and Recrystallized Microstructure in Tantalum with Unidirectional and Clock Rolling
Controlling the microstructure homogeneity is crucial in achieving high quality tantalum (Ta) sputtering targets used in integrated circuit fabrication. Unluckily, traditional rolling easily generates a microstructure gradient along the thickness direction in Ta sheets. The deformation and recrystal...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2019-01-01
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| Series: | Materials |
| Subjects: | |
| Online Access: | http://www.mdpi.com/1996-1944/12/1/169 |