Thermal Modeling of IC Packages by Using ANSYS Simulation
For the design of an IC package, one of the primary concerns is the critical temperature limit, where the chip surface temperature of the designed package has to be below the critical temperature limit. The current testing method requires a long testing time, high cost and complex procedures. Theref...
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| Format: | Article |
| Language: | Thai |
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Mahasarakham University
2019-10-01
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| Series: | Warasan Witthayasat Lae Theknoloyi Mahawitthayalai Mahasarakham |
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| Online Access: | http://journal.msu.ac.th/upload/articles/article2523_66535.pdf |