Numerical Investigation of Pileup Process in Metal Microdroplet Deposition Manufacture
This paper presents a systematic numerical investigation of the transient transport phenomenon during the pileup of molten metal droplets on the substrate. The physical mechanisms of the pileup process, including the bulk liquid, capillarity effects at the liquid-solid interface, heat transfer, and...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2014-12-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | http://www.mdpi.com/2072-666X/5/4/1429 |