The electromigration effect revisited: non-uniform local tensile stress-driven diffusion
Abstract The electromigration (EM) effect involves atomic diffusion of metals under current stressing. Recent theories of EM are based on the unbalanced electrostatic and electron-wind forces exerted on metal ions. However, none of these models have coupled the EM effect and lattice stability. Here,...
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doaj-e7e182a4b85c4c0994c957dfef0de6972020-12-08T01:46:03ZengNature Publishing GroupScientific Reports2045-23222017-06-017111010.1038/s41598-017-03324-5The electromigration effect revisited: non-uniform local tensile stress-driven diffusionShih-kang Lin0Yu-chen Liu1Shang-Jui Chiu2Yen-Ting Liu3Hsin-Yi Lee4Department of Materials Science and Engineering, National Cheng Kung UniversityDepartment of Materials Science and Engineering, National Cheng Kung UniversityNational Synchrotron Radiation Research CenterNational Synchrotron Radiation Research CenterNational Synchrotron Radiation Research CenterAbstract The electromigration (EM) effect involves atomic diffusion of metals under current stressing. Recent theories of EM are based on the unbalanced electrostatic and electron-wind forces exerted on metal ions. However, none of these models have coupled the EM effect and lattice stability. Here, we performed in situ current-stressing experiments for pure Cu strips using synchrotron X-ray diffractometry and scanning electron microscopy and ab initio calculations based on density functional theory. An intrinsic and non-uniform lattice expansion – larger at the cathode and smaller at the anode, is identified induced by the flow of electrons. If this electron flow-induced strain is small, it causes an elastic deformation; while if it is larger than the yield point, diffusion as local stress relaxation will cause the formation of hillocks and voids as well as EM-induced failure. The fundamental driving force for the electromigration effect is elucidated and validated with experiments.https://doi.org/10.1038/s41598-017-03324-5 |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Shih-kang Lin Yu-chen Liu Shang-Jui Chiu Yen-Ting Liu Hsin-Yi Lee |
spellingShingle |
Shih-kang Lin Yu-chen Liu Shang-Jui Chiu Yen-Ting Liu Hsin-Yi Lee The electromigration effect revisited: non-uniform local tensile stress-driven diffusion Scientific Reports |
author_facet |
Shih-kang Lin Yu-chen Liu Shang-Jui Chiu Yen-Ting Liu Hsin-Yi Lee |
author_sort |
Shih-kang Lin |
title |
The electromigration effect revisited: non-uniform local tensile stress-driven diffusion |
title_short |
The electromigration effect revisited: non-uniform local tensile stress-driven diffusion |
title_full |
The electromigration effect revisited: non-uniform local tensile stress-driven diffusion |
title_fullStr |
The electromigration effect revisited: non-uniform local tensile stress-driven diffusion |
title_full_unstemmed |
The electromigration effect revisited: non-uniform local tensile stress-driven diffusion |
title_sort |
electromigration effect revisited: non-uniform local tensile stress-driven diffusion |
publisher |
Nature Publishing Group |
series |
Scientific Reports |
issn |
2045-2322 |
publishDate |
2017-06-01 |
description |
Abstract The electromigration (EM) effect involves atomic diffusion of metals under current stressing. Recent theories of EM are based on the unbalanced electrostatic and electron-wind forces exerted on metal ions. However, none of these models have coupled the EM effect and lattice stability. Here, we performed in situ current-stressing experiments for pure Cu strips using synchrotron X-ray diffractometry and scanning electron microscopy and ab initio calculations based on density functional theory. An intrinsic and non-uniform lattice expansion – larger at the cathode and smaller at the anode, is identified induced by the flow of electrons. If this electron flow-induced strain is small, it causes an elastic deformation; while if it is larger than the yield point, diffusion as local stress relaxation will cause the formation of hillocks and voids as well as EM-induced failure. The fundamental driving force for the electromigration effect is elucidated and validated with experiments. |
url |
https://doi.org/10.1038/s41598-017-03324-5 |
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