Surface Modification Using Assisting Electrodes in Wire Electrical Discharge Machining for Silicon Wafer Preparation

Surface Modification Using Assisting Electrodes in Wire Electrical Discharge Machining for Silicon Wafer Preparation

This paper outlines notable advances in the wire electrical discharge machining of polycrystalline silicon workpieces for wafer preparation. Our use of assisting electrodes permits the transfer of aluminum particles to the machined surface of the polycrystalline silicon workpieces, to enhance conduc...

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Bibliographic Details
Main Authors: Chunliang Kuo, Yupang Nien, Anchun Chiang, Atsushi Hirata
Format: Article
Language:English
Published: MDPI AG 2021-03-01
Series:Materials
Subjects:
WEDM
assisting electrode
surface modification
material removal
surface topography
parametric optimization
Online Access:https://www.mdpi.com/1996-1944/14/6/1355

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https://www.mdpi.com/1996-1944/14/6/1355

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