Surface Modification Using Assisting Electrodes in Wire Electrical Discharge Machining for Silicon Wafer Preparation
This paper outlines notable advances in the wire electrical discharge machining of polycrystalline silicon workpieces for wafer preparation. Our use of assisting electrodes permits the transfer of aluminum particles to the machined surface of the polycrystalline silicon workpieces, to enhance conduc...
Main Authors: | Chunliang Kuo, Yupang Nien, Anchun Chiang, Atsushi Hirata |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2021-03-01
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Series: | Materials |
Subjects: | |
Online Access: | https://www.mdpi.com/1996-1944/14/6/1355 |
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