Effect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process
The evolution of interfacial morphology and shear strengths of the joints soldered with Sn-0.3Ag-0.7Cu (SAC0307) and SAC0307-0.05Pr aged at 150 °C for different times (h; up to 840 h) were investigated. The experiments showed the electronic joint soldered with SAC0307-0.05Pr has a much high...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2019-09-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/9/17/3590 |