Effect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process

Effect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process

The evolution of interfacial morphology and shear strengths of the joints soldered with Sn-0.3Ag-0.7Cu (SAC0307) and SAC0307-0.05Pr aged at 150 °C for different times (h; up to 840 h) were investigated. The experiments showed the electronic joint soldered with SAC0307-0.05Pr has a much high...

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Main Authors: Jie Wu, Songbai Xue, Jingwen Wang, Guoqiang Huang
Format: Article
Language:English
Published: MDPI AG 2019-09-01
Series:Applied Sciences
Subjects:
SAC0307-0.05Pr solder
aging process
interfacial microstructure
fractograph
Online Access:https://www.mdpi.com/2076-3417/9/17/3590
id doaj-e88960675eeb4db18b48c76cb924a33a
record_format Article
spelling doaj-e88960675eeb4db18b48c76cb924a33a2020-11-24T20:45:00ZengMDPI AGApplied Sciences2076-34172019-09-01917359010.3390/app9173590app9173590Effect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging ProcessJie Wu0Songbai Xue1Jingwen Wang2Guoqiang Huang3College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, ChinaCollege of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, ChinaCollege of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, ChinaCollege of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, ChinaThe evolution of interfacial morphology and shear strengths of the joints soldered with Sn-0.3Ag-0.7Cu (SAC0307) and SAC0307-0.05Pr aged at 150 °C for different times (h; up to 840 h) were investigated. The experiments showed the electronic joint soldered with SAC0307-0.05Pr has a much higher shear strength than that soldered with SAC0307 after each period of the aging process. This contributes to the doping of Pr atoms, “vitamins in alloys”, which tend to be adsorbed on the grain surface of interfacial Cu6Sn5 IMCs, inhibiting the growth of IMCs. Theoretical analysis indicates that doping 0.05 wt.% Pr can evidently lower the growth constant of Cu6Sn5 (DCu6), while the growth constant of Cu3Sn (DCu3) decreased slightly. In addition, the electronic joint soldered with SAC0307-0.05Pr still has better ductility than that soldered with SAC0307, even after a 840-h aging process.https://www.mdpi.com/2076-3417/9/17/3590SAC0307-0.05Pr solderaging processinterfacial microstructurefractograph
collection DOAJ
language English
format Article
sources DOAJ
author Jie Wu
Songbai Xue
Jingwen Wang
Guoqiang Huang
spellingShingle Jie Wu
Songbai Xue
Jingwen Wang
Guoqiang Huang
Effect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process
Applied Sciences
SAC0307-0.05Pr solder
aging process
interfacial microstructure
fractograph
author_facet Jie Wu
Songbai Xue
Jingwen Wang
Guoqiang Huang
author_sort Jie Wu
title Effect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process
title_short Effect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process
title_full Effect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process
title_fullStr Effect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process
title_full_unstemmed Effect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process
title_sort effect of 0.05 wt.% pr addition on microstructure and shear strength of sn-0.3ag-0.7cu/cu solder joint during the thermal aging process
publisher MDPI AG
series Applied Sciences
issn 2076-3417
publishDate 2019-09-01
description The evolution of interfacial morphology and shear strengths of the joints soldered with Sn-0.3Ag-0.7Cu (SAC0307) and SAC0307-0.05Pr aged at 150 °C for different times (h; up to 840 h) were investigated. The experiments showed the electronic joint soldered with SAC0307-0.05Pr has a much higher shear strength than that soldered with SAC0307 after each period of the aging process. This contributes to the doping of Pr atoms, “vitamins in alloys”, which tend to be adsorbed on the grain surface of interfacial Cu6Sn5 IMCs, inhibiting the growth of IMCs. Theoretical analysis indicates that doping 0.05 wt.% Pr can evidently lower the growth constant of Cu6Sn5 (DCu6), while the growth constant of Cu3Sn (DCu3) decreased slightly. In addition, the electronic joint soldered with SAC0307-0.05Pr still has better ductility than that soldered with SAC0307, even after a 840-h aging process.
topic SAC0307-0.05Pr solder
aging process
interfacial microstructure
fractograph
url https://www.mdpi.com/2076-3417/9/17/3590
work_keys_str_mv AT jiewu effectof005wtpradditiononmicrostructureandshearstrengthofsn03ag07cucusolderjointduringthethermalagingprocess
AT songbaixue effectof005wtpradditiononmicrostructureandshearstrengthofsn03ag07cucusolderjointduringthethermalagingprocess
AT jingwenwang effectof005wtpradditiononmicrostructureandshearstrengthofsn03ag07cucusolderjointduringthethermalagingprocess
AT guoqianghuang effectof005wtpradditiononmicrostructureandshearstrengthofsn03ag07cucusolderjointduringthethermalagingprocess
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