Scanning 3DXRD Measurement of Grain Growth, Stress, and Formation of Cu<sub>6</sub>Sn<sub>5</sub> around a Tin Whisker during Heat Treatment

Scanning 3DXRD Measurement of Grain Growth, Stress, and Formation of Cu<sub>6</sub>Sn<sub>5</sub> around a Tin Whisker during Heat Treatment

The 3D microstructure around a tin whisker, and its evolution during heat treatment were studied using scanning 3DXRD. The shape of each grain in the sample was reconstructed using a filtered-back-projection algorithm. The local lattice parameters and grain orientations could then be refined, using...

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Bibliographic Details
Main Authors: Johan Hektor, Stephen A. Hall, N. Axel Henningsson, Jonas Engqvist, Matti Ristinmaa, Filip Lenrick, Jonathan P. Wright
Format: Article
Language:English
Published: MDPI AG 2019-01-01
Series:Materials
Subjects:
tin whiskers
scanning 3DXRD
stress
Cu<sub>6</sub>Sn<sub>5</sub>
Online Access:https://www.mdpi.com/1996-1944/12/3/446

Internet

https://www.mdpi.com/1996-1944/12/3/446

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