Exploiting the Combination of Displacement and Chemical Plating for a Tailored Electroless Deposition of Palladium Films on Copper

Exploiting the Combination of Displacement and Chemical Plating for a Tailored Electroless Deposition of Palladium Films on Copper

Various formulations for electroless deposition, to obtain continuous nanometre-sized and micrometre-sized films of palladium on copper, were compared. We deposited ultrathin films using displacement plating formulations. We obtained continuous films with an equivalent thickness between 6 and 22 nm,...

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Bibliographic Details
Main Authors: Lorenzo Fabbri, Walter Giurlani, Fabio Biffoli, Marco Bellini, Hamish Miller, Claudio Fontanesi, Francesco Vizza, Massimo Innocenti
Format: Article
Language:English
Published: MDPI AG 2021-09-01
Series:Applied Sciences
Subjects:
palladium
electroless deposition
thin films
sustainable catalysts
Online Access:https://www.mdpi.com/2076-3417/11/18/8403

Internet

https://www.mdpi.com/2076-3417/11/18/8403

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