Exploiting the Combination of Displacement and Chemical Plating for a Tailored Electroless Deposition of Palladium Films on Copper
Various formulations for electroless deposition, to obtain continuous nanometre-sized and micrometre-sized films of palladium on copper, were compared. We deposited ultrathin films using displacement plating formulations. We obtained continuous films with an equivalent thickness between 6 and 22 nm,...
Main Authors: | Lorenzo Fabbri, Walter Giurlani, Fabio Biffoli, Marco Bellini, Hamish Miller, Claudio Fontanesi, Francesco Vizza, Massimo Innocenti |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2021-09-01
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Series: | Applied Sciences |
Subjects: | |
Online Access: | https://www.mdpi.com/2076-3417/11/18/8403 |
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