Three-Dimensional Package Design for Electro-Absorption Modulation Laser Array
We report a new 3-D package design technique in this paper. Based on this technique, a 3-D RF impedance matching circuit used in the packaging of electroabsorption modulation laser (EML) array is achieved, which has the characteristics of low electrical crosstalk and small size. The 3-D package desi...
Main Authors: | , , , , , , , |
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Format: | Article |
Language: | English |
Published: |
IEEE
2016-01-01
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Series: | IEEE Photonics Journal |
Subjects: | |
Online Access: | https://ieeexplore.ieee.org/document/7429704/ |