Three-Dimensional Package Design for Electro-Absorption Modulation Laser Array

Three-Dimensional Package Design for Electro-Absorption Modulation Laser Array

We report a new 3-D package design technique in this paper. Based on this technique, a 3-D RF impedance matching circuit used in the packaging of electroabsorption modulation laser (EML) array is achieved, which has the characteristics of low electrical crosstalk and small size. The 3-D package desi...

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Bibliographic Details
Main Authors: Zhike Zhang, Yu Liu, Jiasheng Wang, Jinhua Bai, Haiqing Yuan, Xin Wang, Jianguo Liu, Ninghua Zhu
Format: Article
Language:English
Published: IEEE 2016-01-01
Series:IEEE Photonics Journal
Subjects:
photonic device
three-dimension package
impedance matching circuit
electrical crosstalk
Online Access:https://ieeexplore.ieee.org/document/7429704/

Internet

https://ieeexplore.ieee.org/document/7429704/

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