Three-Dimensional Package Design for Electro-Absorption Modulation Laser Array

• Main Authors: Zhike Zhang, Yu Liu, Jiasheng Wang, Jinhua Bai, Haiqing Yuan, Xin Wang, Jianguo Liu, Ninghua Zhu
• Format: Article
• Language: English
• Published: IEEE 2016-01-01
• Series: IEEE Photonics Journal
• Subjects: photonic device; three-dimension package; impedance matching circuit; electrical crosstalk
• Online Access: https://ieeexplore.ieee.org/document/7429704/

We report a new 3-D package design technique in this paper. Based on this technique, a 3-D RF impedance matching circuit used in the packaging of electroabsorption modulation laser (EML) array is achieved, which has the characteristics of low electrical crosstalk and small size. The 3-D package design technique overcomes the limitation of conventional 2-D design technique in which many bonding wires have to be employed. The measurement results demonstrate that the 3-D impedance matching circuit has a transmission bandwidth of 25 GHz and the reflection is suppressed below -10 dB in a wide frequency range. Compared with NTT's schemes, the 3-D impedance matching circuit and the wires in our scheme have a lower electrical crosstalk. A ten-channel EML module is fabricated, employing the above technique, and demonstrated. The module has good frequency characteristics over a bandwidth of 10 GHz. To our knowledge, this is the first time that such a 3-D impedance matching circuit has been reported publicly.