Three-Dimensional Package Design for Electro-Absorption Modulation Laser Array
We report a new 3-D package design technique in this paper. Based on this technique, a 3-D RF impedance matching circuit used in the packaging of electroabsorption modulation laser (EML) array is achieved, which has the characteristics of low electrical crosstalk and small size. The 3-D package desi...
Main Authors: | Zhike Zhang, Yu Liu, Jiasheng Wang, Jinhua Bai, Haiqing Yuan, Xin Wang, Jianguo Liu, Ninghua Zhu |
---|---|
Format: | Article |
Language: | English |
Published: |
IEEE
2016-01-01
|
Series: | IEEE Photonics Journal |
Subjects: | |
Online Access: | https://ieeexplore.ieee.org/document/7429704/ |
Similar Items
-
Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices
by: Lee Carroll, et al.
Published: (2016-12-01) -
Ion-Induced Electrical Isolation in GaN-Based Platform for Applications in Integrated Photonics
by: Khurram Hussain, et al.
Published: (2019-01-01) -
Virtual qualification methodology for next-generation area-array packages
by: Raghunathan, Rajiv
Published: (2007) -
Reflectionless excitation of arbitrary photonic structures: a general theory
by: Stone A. Douglas, et al.
Published: (2020-10-01) -
Ultra-wideband Butterfly Directly Modulated Semiconductor Lasers
by: Zhike Zhang, et al.
Published: (2017-01-01)