Improving the electrical conductivity of copper/graphene composites by reducing the interfacial impurities using spark plasma sintering diffusion bonding

Improving the electrical conductivity of copper/graphene composites by reducing the interfacial impurities using spark plasma sintering diffusion bonding

The copper/graphene (Cu/Gr) composites made of Gr/Cu/Gr foils with a thickness of 25 μm were prepared using spark plasma sintering diffusion bonding (SPS) and hot press diffusion bonding (HP) in an Ar atmosphere at 900 °C for 20 min under a pressure of 50 MPa. The electrical conductivity of the prep...

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Bibliographic Details
Main Authors: Jian Yang, Yang He, Xiaohui Zhang, Weisan Yang, Yaojun Li, Xiaoman Li, Qiang Chen, Xinye Chen, Ke Du, Yonggang Yan
Format: Article
Language:English
Published: Elsevier 2021-11-01
Series:Journal of Materials Research and Technology
Subjects:
Copper/graphene composites
Electrical conductivity
Spark plasma sintering (SPS)
Interface self-purification
First-principles calculations
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785421010899

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http://www.sciencedirect.com/science/article/pii/S2238785421010899

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