Entanglement across separate silicon dies in a modular superconducting qubit device
Abstract Assembling future large-scale quantum computers out of smaller, specialized modules promises to simplify a number of formidable science and engineering challenges. One of the primary challenges in developing a modular architecture is in engineering high fidelity, low-latency quantum interco...
Main Authors: | , , , , , , , , , , , , , , , , , |
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Format: | Article |
Language: | English |
Published: |
Nature Publishing Group
2021-09-01
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Series: | npj Quantum Information |
Online Access: | https://doi.org/10.1038/s41534-021-00484-1 |