Entanglement across separate silicon dies in a modular superconducting qubit device

Entanglement across separate silicon dies in a modular superconducting qubit device

Abstract Assembling future large-scale quantum computers out of smaller, specialized modules promises to simplify a number of formidable science and engineering challenges. One of the primary challenges in developing a modular architecture is in engineering high fidelity, low-latency quantum interco...

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Bibliographic Details
Main Authors: Alysson Gold, J. P. Paquette, Anna Stockklauser, Matthew J. Reagor, M. Sohaib Alam, Andrew Bestwick, Nicolas Didier, Ani Nersisyan, Feyza Oruc, Armin Razavi, Ben Scharmann, Eyob A. Sete, Biswajit Sur, Davide Venturelli, Cody James Winkleblack, Filip Wudarski, Mike Harburn, Chad Rigetti
Format: Article
Language:English
Published: Nature Publishing Group 2021-09-01
Series:npj Quantum Information
Online Access:https://doi.org/10.1038/s41534-021-00484-1

Internet

https://doi.org/10.1038/s41534-021-00484-1

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