ULTRASONIC SOLDERING OF Cu AND Al2O3 CERAMICS BY USE OF Bi-La AND Bi-Ag-La SOLDERS
This work deals with the effect of solder alloying with a small amount of lanthanum on joint formation with metallic and ceramic substrate. The Bi-Ag – based solder with 2 wt.% lanthanum addition and Bi solder with 2 wt.% lanthanum addition were studied. Soldering was performed by a<br />fluxl...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
CTU Central Library
2016-04-01
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| Series: | Acta Polytechnica |
| Subjects: | |
| Online Access: | https://ojs.cvut.cz/ojs/index.php/ap/article/view/3026 |