Study of interaction between copper and melt of lead-free solders

Problems of reactive diffusion at the interface solid phase - melt were studied theoretically and experimentally. A theoretical description of the kinetics of dissolution of the solid phase in the melt is presented for the case of planar dissolution. The main intention was to study experimentally th...

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Bibliographic Details
Main Authors: P. Jopek, G. Kostiuková, P. Kubíček, J. Drápala
Format: Article
Language:English
Published: Croatian Metallurgical Society 2013-10-01
Series:Metalurgija
Subjects:
tin
Online Access:http://hrcak.srce.hr/file/148602