Impulse Pressuring Diffusion Bonding of TiC Cermet to Stainless Steel Using Ti/Nb Interlayer

Impulse pressuring diffusion bonding(IPDB) and constant pressuring diffusion bonding(CPDB) of TiC cermet to 304 stainless steel(304SS) using Ti/Nb interlayer was carried out at 890℃ under a impulse pressuring of 2-10MPa and a constant pressuring of 10MPa within a duration of only 4-12min, and a robu...

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Bibliographic Details
Main Authors: LI Jia, SHENG Guang-min, HUANG Li
Format: Article
Language:zho
Published: Journal of Materials Engineering 2017-03-01
Series:Journal of Materials Engineering
Subjects:
Online Access:http://jme.biam.ac.cn/CN/Y2017/V45/I3/54