Exploring the correlation between solvent diffusion and creep resistance of Mg-Ga HCP alloys from high throughput liquid-solid diffusion couple

Exploring the correlation between solvent diffusion and creep resistance of Mg-Ga HCP alloys from high throughput liquid-solid diffusion couple

The liquid-solid diffusion couple technique, supported by phenomenological analysis and nano-indentation tests, is proposed on account of the relatively low melting points of Mg to explore the diffusion mobility and creep deformation. The potential of this strategy is demonstrated in MgGa hcp alloy...

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Bibliographic Details
Main Authors: Jingya Wang, Guanglong Xu, Xiaoqin Zeng, Javier Llorca, Yuwen Cui
Format: Article
Language:English
Published: Elsevier 2021-01-01
Series:Materials & Design
Subjects:
Liquid-solid diffusion couple
Hcp Mg-Ga alloys
Diffusion mobility
Creep resistance
Mg solvent diffusion
Online Access:http://www.sciencedirect.com/science/article/pii/S0264127520307784

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http://www.sciencedirect.com/science/article/pii/S0264127520307784

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