Microstructure and Grain Orientation Evolution in SnPb/SnAgCu Interconnects Under Electrical Current Stressing at Cryogenic Temperature

Microstructure and Grain Orientation Evolution in SnPb/SnAgCu Interconnects Under Electrical Current Stressing at Cryogenic Temperature

Electromigration was characterized at the cathode Cu/solder interface&#8212;without the effect of Joule heating&#8212;by employing scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD) analyses. Rapid (Cu<sub>x</sub>,Ni<sub>1&#8722;x</sub>...

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Bibliographic Details
Main Authors: Xing Fu, Yunfei En, Bin Zhou, Si Chen, Yun Huang, Xiaoqi He, Hongtao Chen, Ruohe Yao
Format: Article
Language:English
Published: MDPI AG 2019-05-01
Series:Materials
Subjects:
cryogenic
electromigration
grain orientation
IMC
EBSD
Online Access:https://www.mdpi.com/1996-1944/12/10/1593

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https://www.mdpi.com/1996-1944/12/10/1593

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