Inductance Model of a Backside Integrated Power Inductor in 2.5D/3D Integration
Inductor integration is of vital importance for miniaturization of power supply on chips. In this paper, a backside integrated power inductor is presented. The inductor is placed at the backside of a silicon interposer and connected to the front side metal layers by through-silicon vias (TSVs) for a...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-11-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/10/22/8275 |