Enhanced Thermal Conductivity of Epoxy Composites Filled with Al<sub>2</sub>O<sub>3</sub>/Boron Nitride Hybrids for Underfill Encapsulation Materials

Enhanced Thermal Conductivity of Epoxy Composites Filled with Al<sub>2</sub>O<sub>3</sub>/Boron Nitride Hybrids for Underfill Encapsulation Materials

In this study, a thermal conductivity of 0.22 W·m<sup>−1</sup>·K<sup>−1</sup> was obtained for pristine epoxy (EP), and the impact of a hybrid filler composed of two-dimensional (2D) flake-like boron nitride (BN) and zero-dimensional (0D) spherical micro-sized aluminum oxide...

Full description

Bibliographic Details
Main Authors: William Anderson Lee Sanchez, Chen-Yang Huang, Jian-Xun Chen, Yu-Chian Soong, Ying-Nan Chan, Kuo-Chan Chiou, Tzong-Ming Lee, Chih-Chia Cheng, Chih-Wei Chiu
Format: Article
Language:English
Published: MDPI AG 2021-01-01
Series:Polymers
Subjects:
underfill encapsulation
aluminum oxide
boron nitride
hybrid filler
thermal conductivity
coefficient of thermal expansion
Online Access:https://www.mdpi.com/2073-4360/13/1/147

Internet

https://www.mdpi.com/2073-4360/13/1/147

Similar Items