A Study on Aluminum Pad Large Deformation during Copper Wirebonding for High Power IC Package
In this paper, a 3-D finite element prediction on aluminum pad squeeze during copper wirebonding process for high power IC package is presented. ANSYS Parametric Design Language (APDL) has been implemented on modelling, mesh density, boundary condition (BC), impact stage and contact mode for first b...
Main Authors: | , , |
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Format: | Article |
Language: | English |
Published: |
Taiwan Association of Engineering and Technology Innovation
2018-02-01
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Series: | Advances in Technology Innovation |
Subjects: | |
Online Access: | http://ojs.imeti.org/index.php/AITI/article/view/1026 |