A Study on Aluminum Pad Large Deformation during Copper Wirebonding for High Power IC Package

A Study on Aluminum Pad Large Deformation during Copper Wirebonding for High Power IC Package

In this paper, a 3-D finite element prediction on aluminum pad squeeze during copper wirebonding process for high power IC package is presented. ANSYS Parametric Design Language (APDL) has been implemented on modelling, mesh density, boundary condition (BC), impact stage and contact mode for first b...

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Bibliographic Details
Main Authors: Hsiang-Chen Hsu, Shaw-Yuan Wang, Li-Ming Chu
Format: Article
Language:English
Published: Taiwan Association of Engineering and Technology Innovation 2018-02-01
Series:Advances in Technology Innovation
Subjects:
copper wirebonding
large plastic deformation
impact-contact
hourglass defect
Online Access:http://ojs.imeti.org/index.php/AITI/article/view/1026

Internet

http://ojs.imeti.org/index.php/AITI/article/view/1026

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