A Thermal-Aware On-Line Fault Tolerance Method for TSV Lifetime Reliability in 3D-NoC Systems

A Thermal-Aware On-Line Fault Tolerance Method for TSV Lifetime Reliability in 3D-NoC Systems

Through-Silicon-Via (TSV) based 3D Integrated Circuits (3D-IC) are one of the most advanced architectures by providing low power consumption, shorter wire length and smaller footprint. However, 3D-ICs confront lifetime reliability due to high operating temperature and interconnect reliability, espec...

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Bibliographic Details
Main Authors: Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran
Format: Article
Language:English
Published: IEEE 2020-01-01
Series:IEEE Access
Subjects:
Fault-tolerance
fault detection
parity check
through silicon via
real-time
thermal aware
Online Access:https://ieeexplore.ieee.org/document/9189765/

Internet

https://ieeexplore.ieee.org/document/9189765/

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