A Thermal-Aware On-Line Fault Tolerance Method for TSV Lifetime Reliability in 3D-NoC Systems
Through-Silicon-Via (TSV) based 3D Integrated Circuits (3D-IC) are one of the most advanced architectures by providing low power consumption, shorter wire length and smaller footprint. However, 3D-ICs confront lifetime reliability due to high operating temperature and interconnect reliability, espec...
Main Authors: | Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran |
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Format: | Article |
Language: | English |
Published: |
IEEE
2020-01-01
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Series: | IEEE Access |
Subjects: | |
Online Access: | https://ieeexplore.ieee.org/document/9189765/ |
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