Hot Embossing of Zr-Based Bulk Metallic Glass Micropart Using Stacked Silicon Dies
We demonstrated hot embossing of Zr65Cu17.5Ni10Al7.5 bulk metallic glass micropart using stacked silicon dies. Finite element simulation was carried out, suggesting that it could reduce the stress below 400 MPa in the silicon dies and enhance the durability of the brittle silicon dies when using var...
| Main Authors: | , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Hindawi Limited
2015-01-01
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| Series: | Advances in Materials Science and Engineering |
| Online Access: | http://dx.doi.org/10.1155/2015/179714 |