Copper Electrodeposition on a Magnesium Alloy (AZ80) with a U-Shaped Surface
Cu electrodeposition was performed on a cylindrical AZ80 substrate with a U-shaped surface. A uniform deposition of Cu was achieved on an AZ80 electrode via galvanostatic etching, followed by Cu electrodeposition in an eco-friendly alkaline Cu plating bath. Improper wetting and lower rotational spe...
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2014-11-01
|
| Series: | Materials |
| Subjects: | |
| Online Access: | http://www.mdpi.com/1996-1944/7/11/7366 |