Automotive Power Module Packaging: Current Status and Future Trends

Automotive Power Module Packaging: Current Status and Future Trends

Semiconductor power modules are core components of power electronics in electrified vehicles. Packaging technology often has a critical impact on module performance and reliability. This paper presents a comprehensive review of the automotive power module packaging technologies. The first part of th...

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Bibliographic Details
Main Authors: Yuhang Yang, Lea Dorn-Gomba, Romina Rodriguez, Christopher Mak, Ali Emadi
Format: Article
Language:English
Published: IEEE 2020-01-01
Series:IEEE Access
Subjects:
Electric vehicles
power electronics
semiconductor device packaging
Online Access:https://ieeexplore.ieee.org/document/9178734/

Internet

https://ieeexplore.ieee.org/document/9178734/

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