Automotive Power Module Packaging: Current Status and Future Trends
Semiconductor power modules are core components of power electronics in electrified vehicles. Packaging technology often has a critical impact on module performance and reliability. This paper presents a comprehensive review of the automotive power module packaging technologies. The first part of th...
Main Authors: | Yuhang Yang, Lea Dorn-Gomba, Romina Rodriguez, Christopher Mak, Ali Emadi |
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Format: | Article |
Language: | English |
Published: |
IEEE
2020-01-01
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Series: | IEEE Access |
Subjects: | |
Online Access: | https://ieeexplore.ieee.org/document/9178734/ |
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